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BACKGRINDING WHEELS, USED FOR THE THINNING AND FINE GRINDING OF THE SILICON WAFER

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HENAN ZG INDUSTRIAL PRODUCTS CO.,LTD

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BACKGRINDING WHEELS, USED FOR THE THINNING AND FINE GRINDING OF THE SILICON WAFER

Brand Name : ZG

Model Number : MS

Certification : CE

Place of Origin : CHINA

MOQ : 1 Piece

Price : Negotiation

Payment Terms : L/C, T/T, D/A, D/P, Western Union, MoneyGram

Supply Ability : 10000 pieces per month

Delivery Time : 7-10 work days

Packaging Details : Strong wooden box for global shipping

Dimension(l*w*h) : Customized

Bond type : electroformed, metal (sintered), resin, and vitrified

Applicaiton : Backgrinding Wheels

Feature : Reduced sub-surface damage Excellent wheel wear characteristics

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Backgrinding Wheels

Backgrinding Wheels, are mainly used for the thinning and fine grinding of the silicon wafer

Our diamond wheels offer durability and accuracy by employing the most advanced engineering techniques and precision processing for back grind thinning.

Our particle holding strength minimizes processing contamination and provides high consistency throughout the product’s life with reduced sub-surface damage. A variety of standard offering are available depending on the material to be processed, however we can custom adjust and modify our formulations to satisfy the unique nature of most applications.

Advantages

Reduced sub-surface damage
Excellent wheel wear characteristics
Low heat generation
Optimized for shelf sharpening
Controlled diamond distribution
Consistent removal rates

Common Material Applications

Ceramic
Hard Alloy
Glass
Quartz
Sapphire
Silicon
Silicon Carbide

Common Tool Configurations

Disco®
Okamoto®
Strasbaugh®
TSK®

Please contact us for additional details.

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